Freezing edge know-how: A brand new plasma-based etching course of may result in denser knowledge storage in telephones, cameras, and computer systems. Researchers have developed a hydrogen fluoride plasma approach that doubles the etching price within the manufacturing strategy of 3D NAND flash reminiscence chips.
Normal NAND flash storage is utilized in microSD playing cards, USB drives, and solid-state drives in computer systems and telephones. To suit extra gigabytes into smaller areas, producers have begun stacking reminiscence cells vertically in a course of known as 3D NAND.
Developments in 3D NAND have pushed chip designs past 200 layers, with corporations like Micron, SK Hynix, and Samsung already eyeing 400-layer know-how to extend storage density. Nonetheless, larger layer counts additionally carry better manufacturing complexity. One significantly demanding course of is etching, which requires meticulously carving exact holes, layer by layer, by alternating silicon oxide and silicon nitride layers.
Researchers from Lam Analysis, the College of Colorado Boulder, and the Princeton Plasma Physics Laboratory (PPPL) have developed a brand new approach to streamline the method. It makes use of cryogenic (low-temperature) hydrogen fluoride plasma to etch the holes. In experiments, the etch price greater than doubled, rising from 310 nanometers per minute with the previous methodology to 640 nm/min with their method. In addition they discovered that the etched holes have been cleaner.
Seeing advantages, the researchers experimented with including a couple of different elements to the hydrogen fluoride plasma recipe. Phosphorus trifluoride acted as a nitrous enhance for silicon dioxide etching, quadrupling the speed. In addition they examined ammonium fluorosilicate. The group detailed its findings in a research printed within the Journal of Vacuum Science & Expertise.
Seeing advantages, the researchers explored including a couple of different elements to this hydrogen fluoride plasma recipe. Phosphorus trifluoride acted as a nitrous enhance for the silicon dioxide etching, quadrupling that price. In addition they examined out ammonium fluorosilicate. The total findings might be discovered within the research printed within the Journal of Vacuum Science & Expertise.
Whereas some challenges stay, the brand new approach may overcome a major manufacturing hurdle. Igor Kaganovich, a principal analysis physicist at PPPL, identified that rising reminiscence density will likely be essential as knowledge calls for develop with AI adoption.
It is too early to say if this may end in cheaper or denser NAND chips for shoppers. The approach nonetheless must be confirmed commercially viable and scaled for mass manufacturing. Even when producers undertake the method, there is not any assure that any price financial savings will trickle all the way down to shoppers.
